Kerafen USA works by leveraging a unique blend of 15 exotic nutrients and herbs specifically formulated to combat toenail fungus at its core. The primary mechanism involves breaking through the fungal biofilm—a protective shield that makes the fungus resistant to traditional treatments. By targeting and disrupting this biofilm, Kerafen enables its potent antifungal ingredients to penetrate deeply and eliminate the fungus more effectively than conventional methods. This breakthrough approach ensures that the stubborn fungus is eradicated, leading to healthier and clearer toenails.
One of the key ingredients in Kerafen is undecylenic acid, a powerful antifungal compound that halts fungal DNA replication. This, along with other ingredients like tea tree essential oil and clove bud essential oil, provides strong antifungal properties that cleanse the nail area and disrupt the fungal membranes. The inclusion of these natural antifungal agents ensures that the fungus is not only removed but also prevented from returning, offering a long-term solution to toenail fungus.
Kerafen USA also focuses on nourishing and repairing the nails and surrounding skin. Ingredients such as aloe vera leaf, sweet almond oil, and vitamin E oil promote healing, reduce inflammation, and enhance skin health. These components work together to soothe the affected areas, support nail repair, and improve the overall condition of the feet. By providing these additional benefits, Kerafen ensures that the nails and skin are not only free from fungus but also healthier and more resilient.
Kerafen supports the overall foot microbiome, which plays a crucial role in defending against harmful pathogens. By maintaining a balanced microbial environment on the feet, Kerafen helps prevent future fungal infections and promotes overall foot health. This comprehensive approach, combining powerful antifungal action with skin nourishment and microbiome support, makes Kerafen an effective and holistic solution for combating toenail fungus and enhancing foot health.
